Events



Symposium #11, co-organized by MUNDFAB team member A. Hemeryck of CNRS-LAAS
Materials for Microelectronics: Manufacturing Process, Implantation and Reliability, from Atomic Scale to Industrial Design
at the MMM10 (10th International Conference on Multiscale Materials Modeling)
Baltimore, USA, October 2-7, 2022

This symposium will bring together researchers working on materials for microelectronics. It will focus on theory, simulations and experiments for manufacturing process, implantation and reliability and how modeling and simulations can predict their impact on macroscopic properties of achieved devices. The aim of this symposium is to address those issues at different space and times scales with the additional objective to bridge scales from atomistic-to-continuum approaches in the scope of industrial applications.



26th International Conference on Simulation of Semiconductor Processes and Devices

September 27 - 29, 2021, Dallas, USA, with live stream and recording

The following papers will report on results from MUNDFAB:

S5.4: A. Jay et al.
Clusters of Defects as a Possible Origin of Random Telegraph Signal in Imager Devices: a DFT based Study

S11.1: P.L. Julliard et al.
Kinetic Monte Carlo for Process Simulation: First Principles Calibrated Parameters for BO2 Complex



51st European Solid-State Device Research Conference (ESSDERC 2021)

September 6 - November 30, 2021, fully virtual conference

In the Session Simulation & Modeling of Defects & Traps the following papers will report on results from MUNDFAB:

L. Cvitkovich et al.
Multiscale Modeling Study of Native Oxide Growth on a Si(100) Surface

D. Milardovich et al.
Machine Learning Prediction of Defect Structures in Amorphous Silicon Dioxide

C. Wilhelmer et al.
Statistical Ab Initio Analysis of Electron Trapping Oxide Defects in the Si/SiO2 Network

In the Educational Event Atomistic Simulations Supporting New materials & Process Developments, which is co-organized by MUNDFAB team member D. Rideau of STMicroelectronics, speakers from MUNDFAB will deliver the following lectures:

A. Hemeryck
What Multi-level Strategy for Modelling Processes and Defects in Semiconductors at the Atomic Scale? Current Approaches, Necessary Developments and new Needs

M. Jech
Modeling of Bulk and Interface Defects for Reliability Prediction on the Atomistic Scale



25th International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2020)

September 23 - October 6, 2020, all-virtual conference

The following papers report on results from MUNDFAB:

P.L. Julliard et al.,
Implant Heating Contribution to Amorphous Layer: a KMC Approach (Presentation 3-3)

I. Bejenari et al.
Molecular Dynamics Modeling of the Radial Heat Transfer from Silicon Nanowires (Presentation 4-2)

A. Sciuto et al.,
Advanced Simulations on Laser Annealing: Explosive Crystallization and Phonon Transport Corrections (Presentation 4-3)

D. Milardovich et al.,
Machine Learning Prediction of Formation Energies in a-SiO2 (Presentation 15-2)