Symposium #11
Materials for Microelectronics: Manufacturing Process, Implantation and Reliability, from Atomic Scale to Industrial Design
at the MMM10 (10th International Conference on Multiscale Materials Modeling)
Baltimore, USA, October 2-7, 2022

This symposium will bring together researchers working on materials for microelectronics. It will focus on theory, simulations and experiments for manufacturing process, implantation and reliability and how modeling and simulations can predict their impact on macroscopic properties of achieved devices. The aim of this symposium is to address those issues at different space and times scales with the additional objective to bridge scales from atomistic-to-continuum approaches in the scope of industrial applications.

25th International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2020)

September 23 - October 6, 2020, all-virtual conference

The following papers report on results from MUNDFAB:

P.L. Julliard et al.,
Implant Heating Contribution to Amorphous Layer: a KMC Approach (Presentation 3-3)

I. Bejenari et al.,
Molecular Dynamics Modeling of the Radial Heat Transfer from Silicon Nanowires (Presentation 4-2)

A. Sciuto et al.,
Advanced Simulations on Laser Annealing: Explosive Crystallization and Phonon Transport Corrections (Presentation 4-3)

D. Milardovich et al.,
Machine Learning Prediction of Formation Energies in a-SiO2 (Presentation 15-2)