10th International Conference on Multiscale Materials Modeling (MMM 10)
October 2-7, 2022, Baltimore, USA
Symposium #11: Materials for Microelectronics: Manufacturing Process, Implantation and Reliability, from Atomic Scale to Industrial Design is co-organized by MUNDFAB team member A. Hemeryck of CNRS-LAAS. The symposium will bring together researchers working on materials for microelectronics. It will focus on theory, simulations and experiments for manufacturing process, implantation and reliability and how modeling and simulations can predict their impact on macroscopic properties of achieved devices. The aim of this symposium is to address those issues at different space and times scales with the additional objective to bridge scales from atomistic-to-continuum approaches in the scope of industrial applications.
The following invited presentation reports on results from MUNDFAB: